PASADENA, Calif.–(BUSINESS WIRE)–DTP Thermoelectrics has been awarded a patent that opens the door for solid-state deep cooling thermal management. The patent is based on theoretical and analytical models that have been validated through the fabrication and characterization of thermoelectric devices that use Distributed Transport Properties (DTP) thermoelectric materials. Sample tests, using standard protocols, demonstrate significant increases in maximum cooling temperature, efficiency (COP)